NANOFAB 100 platform: Plasma techniques cluster

This cluster contains:

• Plasma etching module (PE Module)
• Plasma enhanced deposition module (PED Module)
• Plasma cleaning module (PC Module)
• Ultra-high vacuum module for sample storage, revolution, transportation (SSRT module)
• Loading module for batch techniques (FDL module)
• Ultra-high vacuum radial distribution center/module (RDC module)

   The plasma techniques cluster is used to perform cleaning, etching and deposition procedures. In particular it provides:
- express sub-micron etching of dielectrics (SiO₂, Si3N₄)
- etching of metals, including ion etching of gold, copper and other metals that produce no volatile composition
- etching of monocrystal silicon in various types of processes
- etching of arsenides and nitrides of gallium
- etching of polyimide, removal of resist
- deposition of dielectrics with high quality and uniformity (SiO₂, Si₃N₄)
- treatment in hydrogen plasma and atomic hydrogen

• Cluster overall dimensions - 320х320 cm.