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NANOFAB 100 platform: Plasma techniques cluster

Plasma techniques cluster

This cluster contains:

   The plasma techniques cluster is used to perform cleaning, etching and deposition procedures. In particular it provides:
- express sub-micron etching of dielectrics (SiO2, Si3N4)
- etching of metals, including ion etching of gold, copper and other metals that produce no volatile composition
- etching of monocrystal silicon in various types of processes
- etching of arsenides and nitrides of gallium
- etching of polyimide, removal of resist
- deposition of dielectrics with high quality and uniformity (SiO2, Si3N4)
- treatment in hydrogen plasma and atomic hydrogen

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