NANOFAB 100 platform: Plasma processing cluster
Plasma processing cluster
This cluster contains:
- PE module - plasma etching module
- PC module - plasma cleaning module
- RDC module - UHV radial distribution module
- LS module - Module for sample loading and storage
- RT module - UHV module for sample revolution and transportation
The plasma techniques cluster is used to perform cleaning, etching and deposition procedures. In particular it provides:
- express sub-micron etching of dielectrics (SiO2, Si3N4)
- etching of metals, including ion etching of gold, copper and other metals that produce no volatile composition
- etching of monocrystal silicon in various types of processes
- etching of arsenides and nitrides of gallium
- etching of polyimide, removal of resist
- deposition of dielectrics with high quality and uniformity (SiO2, Si3N4)
- treatment in hydrogen plasma and atomic hydrogen
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